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| Agilent HSMx-C220 High Performance ChipLEDs Data Sheet Description The HSMx-C220 is the smallest and the most efficient ChipLED package available in the market. The package contains a reflector cup and lens to maximize light extraction. They are available in a wide range of colors. All packages come in 8 mm tape on 7 inch reels which make them suitable for automated pick and place process. The parts are also compatible with IR reflow solder processes. The small package size makes these LEDs prime choices for all backlighting applications and front panel illumination especially where space is a premium. The directional viewing angle of less than 90 degrees makes the parts suitable for use with light guide/ pipe. Features * Small size (2 x 1.25 x 1.2 mm) * High performance (with reflector cup and lens) * Directional optics * Industry standard footprint * Compatible with IR solder * Operating temperature range of -40C to +85C * Available in 8 mm tape on 7 in. (178 mm) diameter reels Applications (Indoor) * Keypad backlighting * Push-button backlighting * LCD backlighting * Symbol backlighting * Front panel indicator Device Selection Guide Part Number HSMA-C220 HSMC-C220 HSML-C220 HSMU-C220 HSMM-C220 HSMN-C220 HSMD-C220 HSMG-C220 HSMS-C220 HSMY-C220 HSMH-C220 Color AS AlInGaP Amber AS AlInGaP Red AS AlInGaP Orange TS AlInGaP Amber InGaN Green InGaN Blue GaP Orange GaP Green GaP HER GaP Yellow AS AlGaAs Red Package Description Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Untinted, non-diffused Package Dimensions 2.00 (0.08) 1.25 (0.05) 0.63 (0.025) POLARITY 1.20 (0.048) 0.50 (0.02) 1.25 (0.05) GREEN CATHODE MARKING 0.45 (0.018) 1.25 (0.05) 1.16 (0.046) SOLDERING PAD NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current Peak Pulsing Current[1] Power Dissipation Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Note: 1. Pulse condition of 1/10 duty and 0.1 ms width. AlInGaP 30 100 78 5 95 InGaN 25 100 105 5 95 -40 to +85 -40 to +100 AlGaAs 25 100 65 5 95 GaP 20 100 52 5 95 Units mA mA mW V C C C Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 1.9 1.9 2.2 3.5 3.5 2.2 2.2 2.1 2.1 1.8 2.6 2.6 2.6 2.6 4.1 4.1 2.6 2.6 2.6 2.6 2.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 5 5 5 5 5 5 5 Capacitance C(pF), VR = 0, f = 1 MHz Typ. 48 48 52 40 53 55 10 7 4 3 26 Thermal Resistance RJ-PIN Typ. 485 485 485 485 380 380 450 450 450 450 350 Color AS Amber AS Red AS Orange TS Amber InGaN Green InGaN Blue GaP Orange GaP Green GaP HER GaP Yellow AlGaAs Red 3 Optical Characteristics at TA = 25C Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. 63 63 63 100 63 25 6.3 10 6.3 6.3 25 180 180 180 300 230 70 25 30 20 20 80 Peak Wavelength peak (nm) Typ. 595 637 609 595 523 468 605 570 630 589 660 Color, Dominant Wavelength d[2] (nm) Typ. 592 626 605 592 525 470 604 572 626 586 639 Viewing Angle 2 1/2 Degrees[3] Typ. 85 85 85 85 65 65 75 75 75 75 75 Luminous Efficacy v (lm/w) Typ. 500 155 385 490 490 70 350 540 135 480 75 Color AS Amber AS Red AS Orange TS Amber InGaN Green InGaN Blue GaP Orange GaP Green GaP HER GaP Yellow AlGaAs Red Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 1.0 GREEN AIGaAs RELATIVE INTENSITY YELLOW 0.5 ORANGE HER 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1a. Relative intensity vs. wavelength for GaP and AlGaAs. 1 ORANGE RELATIVE INTENSITY 0.8 AMBER 0.6 0.4 RED 0.2 0 500 550 600 WAVELENGTH - nm 650 700 Figure 1b. Relative intensity vs. wavelength for AlInGaP. 1.0 RELATIVE INTENSITY - % BLUE GREEN 0.5 0 350 400 450 500 WAVELENGTH - nm 550 600 650 Figure 1c. Relative intensity vs. wavelength for InGaN. 5 100 IF - FORWARD CURRENT - mA AIGaAs 10 GREEN 1 YELLOW 0.1 1.5 HER 1.7 ORANGE 1.9 2.1 2.3 2.5 VF - FORWARD VOLTAGE - V 100 IF - FORWARD CURRENT - mA 10 TS AllnGap InGaN GREEN 1 AS AllnGaP InGaN BLUE 0.1 1.5 2.5 3.5 4.5 VF - FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage. 1.6 AlGaAs LUMINOUS INTENSITY (NORMALIZED AT 20 mA) LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 1.2 1.0 0.8 0.6 0.4 0.2 0 1.2 0.8 0.4 GaP 0 0 10 20 30 40 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 0 5 10 15 20 25 IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA Figure 3a. Luminous intensity vs. forward current - GaP and AlGaAs. Figure 3b. Luminous intensity vs. forward current - AlInGaP. Figure 3c. Luminous intensity vs. forward current - InGaN. 6 IF MAX. - MAXIMUM FORWARD CURRENT IF MAX. - MAXIMUM FORWARD CURRENT 35 R0JA = 600C/W 30 25 20 15 10 TS AllnGaP 5 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE TA - DEG AS AllnGaP 30 R0JA = 600C/W 25 GaP 20 15 10 5 0 InGaN AIGaAs 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE TA - DEG Figure 4. Maximum forward current vs. ambient temperature. 1 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 65 85 75 10 20 30 40 50 60 70 80 90 ANGLE - DEGREES Figure 5. Radiation pattern. 7 10 SEC. MAX. TEMPERATURE 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. -3C/SEC. MAX. 0.90 (0.035) 0.90 (0.035) 1.15 (0.045) 1.06 (0.042) Figure 6. Recommended reflow soldering profile. Figure 7. Recommended soldering pattern. USER FEED DIRECTION PRINTED LABEL CATHODE SIDE Figure 8. Reeling orientation. 180 O (7.08) 21.0 (0.83) 2.0 (0.08) 60.0 O (2.36) O 13.0 (0.51) LABEL 1.5 TYP. (0.06) 13.0 (0.51) 10.0 (0.39) Figure 9. Reel dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. 8 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C220 SERIES DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 2.44 (0.096) 1.68 (0.066) 1.30 (0.051) Figure 10. Tape dimensions. END START THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCHES) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCHES) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 11. Tape leader and trailer dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. 9 Intensity Bin Limits Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Intensity Range (mcd) Min. Max. 0.10 0.20 0.16 0.32 0.25 0.50 0.40 0.80 0.63 1.25 1.00 2.00 1.60 3.20 2.50 5.00 4.00 8.00 6.30 12.50 10.00 20.00 16.00 32.00 25.00 50.00 40.00 80.00 63.00 125.00 100.00 200.00 160.00 320.00 250.00 500.00 400.00 800.00 630.00 1250.00 1000.00 2000.00 1600.00 3200.00 2500.00 5000.00 HSMG-C220 Bin ID A B C D E HSMA-C220 Bin ID A B C D H J HSMD-C220 Bin ID A B C D E F Dom. Wavelength (nm) Min. Max. 596.0 601.0 599.0 604.0 602.0 607.0 605.0 610.0 608.0 613.0 611.0 616.0 Dom. Wavelength (nm) Min. Max. 581.5 585.0 584.0 587.5 586.5 590.0 589.5 592.5 591.5 595.0 594.0 597.5 Dom. Wavelength (nm) Min. Max. 561.0 565.0 564.0 568.0 567.0 571.0 570.0 574.0 573.0 577.0 HSMN-C220 Bin ID A B C D E HSMM-C220 Bin ID A B C D E 10 Dom. Wavelength (nm) Min. Max. 514.0 521.0 519.0 526.0 524.0 531.0 529.0 536.0 534.0 541.0 Dom. Wavelength (nm) Min. Max. 459.0 465.0 463.0 469.0 467.0 473.0 471.0 477.0 475.0 481.0 Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicators Components and Application Note 1217 Pick and Place and Soldering of the Agilent HSMXC540, HSMx-C220 Surface Mount LEDs respectively. Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicators becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours. 11 www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright (c) 2002 Agilent Technologies, Inc. Obsoletes 5988-6549EN June 24, 2002 5988-7126EN |
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